Ansys Semiconductor products provide a comprehensive suite of multiphysics EM/IR, thermal and electromagnetic simulation engines designed to support third-party IC implementation flows for digital and transistor-level design.

Best practices for ensuring and predicting semiconductor’s electronics reliability require comprehensive multi-physics simulations. Ansys ensures reliability success by developing solutions and workflows that overcome today’s biggest simulation and design challenges.

CAPABILITIES

Design Democratization

Ansys Electronics Reliability solutions allow organizations to capture a wide-range of parts, materials, simulation and other data, as well as access to critical, simulation-ready material and component data.

Workflow Automation

Ansys Electronics Reliability tools allow engineers to create comprehensive simulation workflows that include high-levels of automation.

Robust Reliability Predictions

Reliability predictions based on physics of failure (PoF) principles resides at the core of the Ansys Electronics Reliability portfolio. Using Ansys simulation tools, electronics manufacturers can determine how long it takes for a product to fail and why the failure occurred.

Electrical, Thermal and Mechanical Analysis

Integrated workflows between Ansys Sherlock, Icepak, Mechanical, LS-DYNA, and more provide the simulation results necessary to optimize product designs and ensure reliability in the field.

Warpage and Solder Joint Reliability 

Accurately quantifying component and PCB Coefficient of thermal expansion (CTEs) and conducting informed thermal cycling simulations can provide companies with actionable data to determine if products face solder fatigue risk and what solutions exist to mitigate the risk.

PRODUCTS

HFSS

A 3D EM field solver to design high-frequency and high-speed electronic components. Its FEM, IE, asymptotic and hybrid solvers address RF, microwave, IC, PCB and EMI problems.

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SIwave

A specialized tool for power integrity, signal integrity and EMI analysis of IC packages and PCBs. Solves power delivery systems and high-speed channels in electronic devices.

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Icepak

A CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, power electronics.

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Sherlock

Electronics design software that provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early design stages.

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Electronics Enterprise

Premier software package for the engineer solving problems across the electronics design spectrum. All Ansys electronics technologies are included in this single user package.

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Q3D Extractor

A 2D and 3D EM field simulator to extract RLCG parameters from an interconnect. It’s a parasitic extraction tool to design electronic packaging and power electronic devices.

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Mechanical

Solve broad structural analysis needs with a suite of finite element analysis (FEA) solutions that provides in-depth analysis of structural and coupled-field behaviors.

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LS-DYNA

Ansys LS-DYNA is the industry-leading explicit simulation software used for applications like drop tests, impact and penetration, smashes and crashes, occupant safety, and more.

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