Ansys electromagnetic field simulation helps you design innovative electrical and electronic products faster and more cost-effectively. Ansys software can uniquely simulate electromagnetic performance across component, circuit and system design, and can evaluate temperature, vibration and other critical mechanical effects.
This unmatched electromagnetic-centric design flow helps you achieve first-pass system design success for advanced communication systems, high-speed electronic devices, electromechanical components and power electronics systems.
APPLICATIONS
ANTENNAS
The Internet of Things, wearable electronics, 5G, unmanned aerial vehicles (UAV) and automotive radar are emerging applications that are driving extreme integration of RF and wireless communications. The ANSYS Antenna and Wireless System design flow delivers the simulation features you need to create reliable, optimized systems faster than your competition.
AUTOMOTIVE RADAR
Analyze complex automotive radar driving scenarios using the powerful and accurate methods of ANSYS HFSS SBR+. Engineers can solve advanced automotive ADAS radar systems and understand the response from a complex automotive driving scenario. Features include SBR+ solution type, parametric antenna sources with far-field overlay and accelerated frequency sweeps.
INSTALLED ANTENNA PERFORMANCE
ANSYS HFSS-SBR+ is a powerful, shooting and bouncing ray (SBR) electromagnetic field solver option for HFSS. HFSS SBR+ predicts performance of antennas mounted to electrically large platforms. Antenna designs created in HFSS can be linked to HFSS SBR+ and placed on an electrically large platform and rapidly solved. This powerful combination enables you to analyze installed performance and optimize antenna placement.
RADIO FREQUENCY INTERFERENCE
With a rapidly increasing number of wireless devices and a finite spectrum in which to operate, the likelihood of these communication systems interfering with each other and degrading the performance of neighboring systems becomes greater every day. The ANSYS RF Option now includes EMIT, the industry-leading software for predicting RF co-site and EMI interference of multiple radio transmitters and receivers.
RF AND MICROWAVE
As communication systems push the limits of component size, weight and performance, engineers must adopt new technologies and smarter workflows by leveraging EM field simulators linked to powerful harmonic balance and transient circuit simulation. ANSYS electromagnetic solutions break the cycle of repeated design iterations and physical prototyping. With ANSYS solutions, you can consistently achieve best-in-class design in a broad range of applications including passive RF/mW components, integrated multichip modules, advanced packaging and RF PCBs.
SIGNAL INTEGRITY
ANSYS provides a complete suite of engineering simulation tools to help identify signal integrity issues early in the design cycle for electronics IC packages, PCBs, connectors and other complex interconnects. ANSYS signal integrity analysis products predict EMI/EMC, signal integrity and power integrity issues — enabling your design team to optimize system performance before build and test.
POWER INTEGRITY
ANSYS provides the world’s leading simulation solution for power delivery from chip to package, PCBs and chassis/casings. ANSYS simulation tools for multifoundry-certified chip-level power sign-off, automated AC operating performance prediction and DC power loss and thermal mitigation ensure chip-package-system power integrity for performance, reliability and cost.
LOW-FREQUENCY ELECTROMAGNETICS
Sensors, actuators, and transformers and other electromagnetic and electromechanical devices are key to the megatrend of electrification. ANSYS low frequency, electromagnetic field simulation software allows you to accurately calculate critical design parameters and automatically create precise system-level device models quickly and accurately.
ELECTRONICS COOLING
ANSYS provides electronics cooling simulation products for chip, package and board thermal analysis as well as thermo-mechanical stress analysis. ANSYS simulation tools help you manage excessive heat that can otherwise lead to increasing leakage and electromigration failures of the chip, as well as analyze die package, PCB and interconnect thermal differential expansion to enhance reliability of the entire electronic system.
ELECTRIC MOTORS
ANSYS delivers a comprehensive motor design methodology that will reduce design cost and optimize size, noise, efficiency and durability. The ANSYS motor design solution delivers robust electromagnetic, thermal and mechanical analyses, combined with power electronic circuit simulation and embedded software tools to analyze the complete motor-driven system.
ELECTROMAGNETIC INTERFERENCE/COMPATIBILITY
ANSYS electromagnetic and circuit technologies empower engineers to mitigate potential EMI issues early in the design cycle. Automated workflows in ANSYS Electronics Desktop leverage easy mechanical CAD (MCAD) and electrical CAD (ECAD) system assemblies to simulate complete electrical devices, increase their immunity and meet EMC standards using a single simulation platform.
ELECTRONICS RELIABILITY
Ansys possesses the unique ability to capture all facets of electronic reliability in a comprehensive workflow that allows for true multiphysics analysis.
POWER ELECTRONICS
From electric drives to power supplies and robotic systems, ANSYS is the choice for power electronics designers worldwide. With ANSYS power electronics design solutions, you can achieve first-pass system success and deliver efficient, optimized designs in less time and with less cost.
RADAR CROSS SECTION (RCS)
Model the radar signatures of electrically very large targets and scenes with the powerful HFSS SBR+ solver. Engineers can easily perform fast radar cross section (RCS) calculations to detect objects such as aircrafts, vehicles and ships, as well as design these objects to minimize radar detection.
RF DESENSE
Radio frequency desensitization (RF desense) is a form of RF interference (RFI) that results in reduced performance, or “desensitization,” of wireless systems that are integrated into electronic devices. Combining ANSYS HFSS with EMIT, a capability within ANSYS RF Option, can identify and eliminate desense in wireless electronic products.
PRODUCTS
HFSS
A 3D EM field solver to design high-frequency and high-speed electronic components. Its FEM, IE, asymptotic and hybrid solvers address RF, microwave, IC, PCB and EMI problems.
Maxwell
An EM field solver for electric machines, transformers, actuators and other electromechanical devices. It solves static, frequency-domain, and time-varying electric fields.
SIwave
A specialized tool for power integrity, signal integrity and EMI analysis of IC packages and PCBs. Solves power delivery systems and high-speed channels in electronic devices.
Icepak
A CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, power electronics.
Sherlock
Electronics design software that provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early design stages.
Motor-CAD
A template-based design tool for fast multiphysics analyses of electric motors across the full torque-speed operating range to optimize their performance, efficiency and size.
EMA3D Cable
Platform-level electromagnetic cable modeling and simulation tool that delivers a design-to-validation workflow including (EMI)/ (EMC) certification support.
Electronics Enterprise
Premier software package for the engineer solving problems across the electronics design spectrum. All Ansys electronics technologies are included in this single user package.
Electronics Pro 2D
Electronics Pro 2D is ideal for 2D low frequency electromagnetic analysis, 2D parameter extraction, RF system analysis for the prediction of radio frequency interference and circuit simulation with advanced RF functionality.
Q3D Extractor
A 2D and 3D EM field simulator to extract RLCG parameters from an interconnect. It’s a parasitic extraction tool to design electronic packaging and power electronic devices.